Supermicro Exhibits New Servers Featuring EDR 100Gb/s InfiniBand at ISC 2015

13 July 2015    Source: http://www.supermicro.com

Frankfurt, Germany, July 13, 2015 - Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server, storage technology and green computing exhibits its latest high performance computing solutions at ISC 2015 this week in Frankfurt Germany. Headlining Supermicro's latest offerings for the HPC community is its new 1U 4x GPU SuperServer (SYS-1028GQ-TR/-TRT) which maximizes performance and density through pioneering non-preheat GPU architecture and PCIe direct connect (no extension cables or re-drivers) for lowest latency. The space optimized design of this system accommodates dual Intel® Xeon® E5-2600 v3 processors (up to 145W), up to 1TB ECC DDR4 2133MHz in 16x DIMMs, quad double-width GPU/Xeon Phi co-processors (up to 300W) plus 2x additional PCI-E 3.0 x8 low-profile slots, 2x 2.5" front-facing hot-swap SATA3 HDD/SSDs, 2x 2.5" internal SATA3 HDD/SSDs, dual port 10GbE LAN and redundant 2000W Titanium Level high-efficiency (96%) digital power supplies. This system is ideal for oil and gas exploration, medical image processing, and many other research and scientific applications such as computational fluid dynamics and astrophysics.

Supermicro exhibits also include its 2U TwinPro²™ and 7U SuperBlade featuring Mellanox EDR 100Gb/s InfiniBand delivering the high bandwidth, extreme low latency and scalability needed to support HPC, Web2.0, and cloud applications. Also on display are the 4U FatTwin™ featuring the industry's highest density 8x 3.5" hot-swap HDDs per U, high-density, high-performance 6U MicroBlade in 28-node Intel® Xeon® E5-2600 v3 and E3-1200 v3/v4 configurations, 2U TwinPro™ dual-node system supporting dual Intel® Xeon® processor E5-2600 v3 and 6x 3.5" hot-swap drive bays per node (up to 4x NVMe + 2x SAS3 or 6x SAS3) and 4U 720TB 90x 3.5" top-load, hot-swap JBOD with redundant SAS3 12Gb/s expanders.

"Supermicro's latest generation of HPC solutions lead the industry in performance, density, bandwidth and value with continuous design innovation in non-preheat GPU system architecture, NVMe U.2 storage technology and integration of leading edge interconnect technologies such as EDR 100Gb/s IB," said Charles Liang, President and CEO of Supermicro. "Our total solutions in TwinPro, FatTwin, SuperBlade, MicroBlade and SuperStorage combine best-in-class design and technologies to provide the HPC community with best performance and accelerated TTM to reach their goals on time and under budget."

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